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0077004302

0077004302 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-0077004302
  • Package: -
  • Datasheet: PDF
  • Stock: 473
  • Description: 0077004302 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material Beryllium Copper
Operating Temperature 121°C
Series Low Profile
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fingerstock
Attachment Method Adhesive
Height 0.080 2.03mm
Length 16.000 406.40mm
Width 0.450 11.43mm
Thickness 2.032mm
REACH SVHC Unknown
RoHS Status RoHS Compliant

0077004302 Overview


Materials from Beryllium Copper are included in the Contact RFI.The EMI/RFI is capable of operating at a temperature of 121°C.A contacter RFI with the Fingerstock type.As you can see, this RFI EMI comes from the well-known Low Profile series of products.

0077004302 Features


Fingerstock
Low Profile series

0077004302 Applications


There are a lot of Laird Technologies EMI 0077004302 RFI and EMI Contacts applications.

  • Power management
  • Low Noise Amplifier
  • Internet of Things
  • LED Lighting
  • Receive
  • Utility Energy
  • Secure Payment
  • Smart Energy
  • Medical
  • Transmit