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0737801234

0737801234 datasheet pdf and Backplane Connectors - Specialized product details from Molex stock available at Utmel


  • Manufacturer: Molex
  • Origchip NO: 514-0737801234
  • Package: -
  • Datasheet: PDF
  • Stock: 729
  • Description: 0737801234 datasheet pdf and Backplane Connectors - Specialized product details from Molex stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Material Copper, Tin
Contact Plating Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Thermoplastic
Operating Temperature -55°C~105°C
Packaging Tube
Series HDM (High Density Metric) 73780
JESD-609 Code e3
Feature Stackable
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 144
Color Black
Number of Rows 6
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.079 2.00mm
Total Number of Contacts 144
Orientation Vertical
Depth 13.4mm
Number of Positions Loaded All
Contact Finish Gold
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Resistance 10mOhm
Max Voltage Rating (AC) 250V
Connector Style HDM
Number of Columns 24
Connector Usage Daughtercard
Length 48.17mm
Contact Finish Thickness 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0

0737801234 Overview


Packaging is in the form of Receptacle, Female Sockets.This device has a Through Hole mounting type.To package the product, we use a Tube case.A member of the HDM (High Density Metric) 73780 Series.A number of advantages are provided by its Stackable feature.Part Through Hole is mounted to the part.Operating temperature is -55°C~105°C.

0737801234 Features


HDM (High Density Metric) 73780 series

0737801234 Applications


There are a lot of Molex 0737801234 Backplane Connectors applications.

  • Automotive Electronics
  • Measuring & Control Technology
  • Refrigeration control
  • Embedded systems
  • LED municipal outdoor and street lighting
  • Communication
  • Telecommunications
  • Instrumentation
  • Transportation
  • Anywhere power is distributed