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10053363-200LF

10053363-200LF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at Utmel


  • Manufacturer: Amphenol ICC (FCI)
  • Origchip NO: 44-10053363-200LF
  • Package: -
  • Datasheet: PDF
  • Stock: 535
  • Description: 10053363-200LF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Contact Material Copper Alloy
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole, Right Angle
Housing Material Thermoplastic
Material - Insulation Thermoplastic
Packaging Tray
Published 2012
Series HPCE®
Feature Board Guide
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Cantilever
Number of Positions 64 (Power)
Max Operating Temperature 105°C
Min Operating Temperature -5°C
Color Black
Number of Rows 2
Gender Female
Contact Type Cantilever
Pitch 0.100 2.54mm
Orientation Right Angle
Current Rating 7A
Contact Finish Gold
Voltage - Rated AC 1kV
Number of Contacts 64
Housing Color Black
Contact Resistance 55mOhm
Card Type Non Specified - Dual Edge
Read Out Dual
Insulation Resistance 5GOhm
Number of Positions/Bay/Row 32
Row Spacing 3.8 mm
Contact Finish Thickness 30.0μin 0.76μm
Card Thickness 0.062 1.57mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free

10053363-200LF Overview


The material was packaged in accordance with the specifications provided by Tray.The mount type Through Hole, Right Angle is recommended.Devices are connected through connector sockets Cantilever.Board Guide features are on this device.Device series is indicated by HPCE?.A temperature of 105°C°C is the maximum operating temperature.Ensure its reliability by working at a minimum temperature of -5°C degrees Celsius.

10053363-200LF Features


HPCE? series

10053363-200LF Applications


There are a lot of Amphenol ICC (FCI) 10053363-200LF Edgeboard Connectors applications.

  • Medical Imaging
  • Microcontrollers.
  • In-building wireless telephony
  • Audio/Video devices
  • Data Acquisition Systems
  • Handheld Terminal Interface
  • Wireless and wired broadband communications
  • TD-SCDMA, WiMAX
  • Instrumentation and test equipment
  • RADAR processing, digital oscilloscopes