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  • 10AS027E2F29E1HG

10AS027E2F29E1HG

0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-10AS027E2F29E1HG
  • Package: 780-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 789
  • Description: 0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Package / Case 780-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 360
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 270K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Package 780-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is part of the Arria 10 SX series of system on a chips.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 270K Logic Elements is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 360 inputs and outputs.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


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