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10AS027H1F35E1HG

0°C~100°C TJ System On ChipArria 10 SX Series 384 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-10AS027H1F35E1HG
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 191
  • Description: 0°C~100°C TJ System On ChipArria 10 SX Series 384 I/O(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 270K Logic Elements
RoHS Status RoHS Compliant
Package / Case 1152-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 384
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Arria 10 SX series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 270K Logic Elements.It is packaged in a state-of-the-art Tray package.384 I/Os in total are included in this SoC part.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


10AS027H1F35E1HG System On Chip (SoC) applications.

  • Samsung galaxy gear
  • Communication interfaces ( I2C, SPI )
  • DC-input BLDC motor drive
  • Temperature Sensors
  • Measurement tools
  • Healthcare
  • Special Issue Editors
  • External USB hard disk/SSD
  • Smartphones
  • POS Terminals