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  • 10AS032E4F29I3LG

10AS032E4F29I3LG

780 TerminationsSystem On Chip0.9V


  • Manufacturer: Altera
  • Origchip NO: 2936-10AS032E4F29I3LG
  • Package: -
  • Datasheet: PDF
  • Stock: 110
  • Description: 780 TerminationsSystem On Chip0.9V (Kg)

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Details

Tags

Parameters
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B780
Number of Outputs 360
Qualification Status Not Qualified
Operating Temperature (Max) 100°C
Operating Temperature (Min) -40°C
Supply Voltage-Max (Vsup) 0.93V
Power Supplies 0.9V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 0.87V
Number of Inputs 360
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Cells 320000
Height Seated (Max) 3.35mm
Length 29mm
Width 29mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 14 Weeks
Surface Mount YES
Published 2016
Part Status Active
Number of Terminations 780
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL

This SoC is built on core processor(s).


A power supply with a 0.9V rating is recommended.In the SoCs wireless, high voltages above 0.93V are considered dangerous and should not be used.Power supply should be at least 0.87V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.Having 780 terminations in total makes system on a chip possible.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.Using this SoC chip, you have the option of having 360 outputs.System on chip requires 0.9V power supplies.This SoC chip has a total of 360 inputs that can be used.System on chips of logic are comprised of 320000 logic cells.If the temperature rises above 100°C, this SoC on chip may lose its performance.A malfunction of this system on a chip SoC is inevitable when temperatures drop below -40°C.

processor.



There are a lot of Altera


10AS032E4F29I3LG System On Chip (SoC) applications.

  • USB hard disk enclosure
  • Industrial automation devices
  • Industrial robot
  • Cyber security for critical applications in the aerospace
  • Mobile computing
  • Keywords
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  • AC drive control module
  • Temperature
  • Three phase UPS