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10AS032E4F29I3SG

780 Terminations-40°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V


  • Manufacturer: Intel
  • Origchip NO: 386-10AS032E4F29I3SG
  • Package: 780-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 955
  • Description: 780 Terminations-40°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Package / Case 780-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B780
Number of Outputs 360
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 0.93V
Power Supplies 0.9V
Supply Voltage-Min (Vsup) 0.87V
Number of I/O 360
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 360
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 320K Logic Elements
Number of Logic Cells 320000
Height Seated (Max) 3.35mm
Length 29mm
Width 29mm
RoHS Status RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.Its package is 780-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is part of the Arria 10 SX series of system on a chips.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 320K Logic Elements.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 360 I/Os.It is recommended to use a 0.9V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 0.93V.At least 0.87V can be supplied as a power source.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 780 terminations, so system on a chip is really aided by this.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip with 360 outputs is available.System on chip requires 0.9V power supplies.On the SoC chip, there are 360 inputs available for use.In logic system on chips, there are 320000 logic cells.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


10AS032E4F29I3SG System On Chip (SoC) applications.

  • AC drive control module
  • Central alarm system
  • Temperature Sensors
  • Keywords
  • Level
  • Vending machines
  • High-end PLC
  • Microcontroller
  • Industrial sectors
  • Optical drive