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  • 10AS066K4F35I4SGES

10AS066K4F35I4SGES

-40°C~100°C TJ System On ChipArria 10 SX Series 396 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-10AS066K4F35I4SGES
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 662
  • Description: -40°C~100°C TJ System On ChipArria 10 SX Series 396 I/O(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA, FC (35x35)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 396
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 660K Logic Elements

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Arria 10 SX series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 660K Logic Elements.Housed in the state-of-art Tray package.This SoC part contains a total of 396 I/Os in total.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


10AS066K4F35I4SGES System On Chip (SoC) applications.

  • PC peripherals
  • Test and Measurement
  • High-end PLC
  • ARM support modules
  • Smartphone accessories
  • Remote control
  • Personal Computers
  • Microprocessors
  • Digital Signal Processing
  • Vending machines