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  • 10M04SAM153C8G

10M04SAM153C8G

FPGAs MAX? 10 Series 153-VFBGA 153


  • Manufacturer: Intel
  • Origchip NO: 386-10M04SAM153C8G
  • Package: 153-VFBGA
  • Datasheet: PDF
  • Stock: 684
  • Description: FPGAs MAX? 10 Series 153-VFBGA 153 (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 153-VFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 153
Voltage - Supply 2.85V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B153
Number of I/O 112
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4000
Total RAM Bits 193536
Number of LABs/CLBs 250
RoHS Status RoHS Compliant

10M04SAM153C8G Overview


A 153-VFBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 112 I/Os makes data transfers more coherent. To form a fundamental building block, there are 4000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 2.85V~3.465V, this device operates with ease. An FPGA belonging to the MAX? 10 series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Total terminations are 153. This device has 193536 RAM bits, which is the number of RAM bits that this device offers. An array of 250 LABs/CLBs is built into the FPGA.

10M04SAM153C8G Features


112 I/Os
Up to 193536 RAM bits

10M04SAM153C8G Applications


There are a lot of Intel 10M04SAM153C8G FPGAs applications.

  • OpenCL
  • ASIC prototyping
  • Automotive advanced driver assistance systems (ADAS)
  • Military DSP
  • Computer hardware emulation
  • Distributed Monetary Systems
  • Data center search engines
  • Solar Energy
  • Data Mining
  • Secure Communication