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  • 10M04SCU169C8G

10M04SCU169C8G

FPGAs MAX? 10 Series 169-LFBGA 169


  • Manufacturer: Intel
  • Origchip NO: 386-10M04SCU169C8G
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: 818
  • Description: FPGAs MAX? 10 Series 169-LFBGA 169 (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 169-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 169
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B169
Number of I/O 130
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4000
Total RAM Bits 193536
Number of LABs/CLBs 250
RoHS Status RoHS Compliant

10M04SCU169C8G Overview


There is a 169-LFBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 130 I/Os help it transfer data more efficiently. A fundamental building block contains 4000 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 2.85V~3.465V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the MAX? 10 series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. This FPGA model is contained in Tray for space saving. 169 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 193536 bFpga chipss. The FPGA is built as an array of 250 latches or CLBs.

10M04SCU169C8G Features


130 I/Os
Up to 193536 RAM bits

10M04SCU169C8G Applications


There are a lot of Intel 10M04SCU169C8G FPGAs applications.

  • Automotive driver's assistance
  • Medical Electronics
  • Scientific Instruments
  • Integrating multiple SPLDs
  • Data center hardware accelerators
  • Video & Image Processing
  • Broadcast
  • Bioinformatics
  • Aerospace and Defense
  • Solar Energy