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  • 10M08SAE144I7G

10M08SAE144I7G

FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144


  • Manufacturer: Intel
  • Origchip NO: 386-10M08SAE144I7G
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 523
  • Description: FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144 (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G144
Number of I/O 101
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 8000
Total RAM Bits 387072
Number of LABs/CLBs 500
RoHS Status RoHS Compliant

10M08SAE144I7G Overview


A 144-LQFP Exposed Pad package is provided with this component. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. There are 101 I/Os for better data transfer. Logic elements/cells form the fundamental building block of a computer. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 2.85V~3.465V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the MAX? 10 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, it has 144 terminations on each end. As far as the RAM bits are concerned, this device offers you a total of 387072. The FPGA is built as an array of 500 latches or CLBs.

10M08SAE144I7G Features


101 I/Os
Up to 387072 RAM bits

10M08SAE144I7G Applications


There are a lot of Intel 10M08SAE144I7G FPGAs applications.

  • DO-254
  • Wireless Communications
  • Space Applications
  • Defense Applications
  • Wired Communications
  • Voice recognition
  • Aerospace and Defense
  • Military DSP
  • Industrial IoT
  • Server Applications