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  • 10M08SAU169I7G

10M08SAU169I7G

FPGAs MAX? 10 Series 169-LFBGA 169


  • Manufacturer: Intel
  • Origchip NO: 386-10M08SAU169I7G
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: 262
  • Description: FPGAs MAX? 10 Series 169-LFBGA 169 (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 169-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 169
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B169
Number of I/O 130
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 8000
Total RAM Bits 387072
Number of LABs/CLBs 500
RoHS Status RoHS Compliant

10M08SAU169I7G Overview


As part of the 169-LFBGA package, it is included. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. 130 I/Os are available for transferring data more efficiently. A fundamental building block consists of 8000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. There is a 2.85V~3.465V-volt supply voltage required for the device to operate. The MAX? 10 series FPGA is a type of FPGA that belongs to the MAX? 10 family of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a space-saving measure, this FPGA model is contained within Tray. Total terminations are 169. As far as the RAM bits are concerned, this device offers you a total of 387072. A total of 500 LABs/CLBs make up this FPGA array.

10M08SAU169I7G Features


130 I/Os
Up to 387072 RAM bits

10M08SAU169I7G Applications


There are a lot of Intel 10M08SAU169I7G FPGAs applications.

  • Electronic Warfare
  • Aircraft navigation
  • Ecosystem
  • Automotive driver's assistance
  • Solar Energy
  • Radar and Sensors
  • Industrial IoT
  • Distributed Monetary Systems
  • Software-defined radio
  • High Performance Computing