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  • 10M16SAE144C8G

10M16SAE144C8G

FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144


  • Manufacturer: Intel
  • Origchip NO: 386-10M16SAE144C8G
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 614
  • Description: FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144 (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
Voltage - Supply 2.85V~3.465V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G144
Number of I/O 101
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 16000
Total RAM Bits 562176
Number of LABs/CLBs 1000
RoHS Status RoHS Compliant

10M16SAE144C8G Overview


Fpga chips is supplied in the 144-LQFP Exposed Pad package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 101 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 16000 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 2.85V~3.465V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the MAX? 10 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is designed wFpga chipsh 144 terminations. This device has 562176 RAM bits, which is the number of RAM bits that this device offers. The FPGA is built as an array of 1000 latches or CLBs.

10M16SAE144C8G Features


101 I/Os
Up to 562176 RAM bits

10M16SAE144C8G Applications


There are a lot of Intel 10M16SAE144C8G FPGAs applications.

  • Audio
  • Military DSP
  • Digital signal processing
  • Broadcast
  • Telecommunication
  • Automotive advanced driver assistance systems (ADAS)
  • Data Center
  • Wired Communications
  • Data center hardware accelerators
  • Bioinformatics