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  • 10M16SAE144I7G

10M16SAE144I7G

FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144


  • Manufacturer: Intel
  • Origchip NO: 386-10M16SAE144I7G
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 309
  • Description: FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144 (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G144
Number of I/O 101
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 16000
Total RAM Bits 562176
Number of LABs/CLBs 1000
RoHS Status RoHS Compliant

10M16SAE144I7G Overview


A 144-LQFP Exposed Pad package contains it, and it is available for download. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 101 I/Os allow data to be transferred in a more coherent manner. To form a fundamental building block, there are 16000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 2.85V~3.465V . There are many types of FPGAs in the MAX? 10 series, this is one of them. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As a whole, it has 144 terminations. The RAM bits that are offered by this fpga chips are 562176. 1000 LABs/CLBs are integrated into this FPGA.

10M16SAE144I7G Features


101 I/Os
Up to 562176 RAM bits

10M16SAE144I7G Applications


There are a lot of Intel 10M16SAE144I7G FPGAs applications.

  • Data center search engines
  • Wireless Communications
  • Software-defined radio
  • Integrating multiple SPLDs
  • Bioinformatics
  • Automotive advanced driver assistance systems (ADAS)
  • Video & Image Processing
  • ASIC prototyping
  • Automation
  • Radar and Sensors