10M40DAF484C8G

10M40DAF484C8G Overview

There are two packages that contain fpga chips: 484-BGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. This device features 360 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 40000 logic elements/cells. An electrical supply voltage of 1.2V powers it. This FPGA part belongs to the family of Field Programmable Gate Arrays. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 1.15V~1.25V battery. FPGAs belonging to the MAX? 10 series are a type of FPGA that belong to the MAX? 10 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. During the installation of this device, 360 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. 484 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1290240 bFpga chipss. 2500 LABs/CLBs are configured on this FPGA. It is powered by a 1.2V battery, which can be purchased separately.

10M40DAF484C8G Features

360 I/Os
Up to 1290240 RAM bits

10M40DAF484C8G Applications

There are a lot of Intel 10M40DAF484C8G FPGAs applications.

• Automotive
• Medical imaging
• Voice recognition
• Wired Communications
• Data Center
• Ecosystem
• Development Boards and Shields for Microcontrollers
• Video & Image Processing
• Consumer Electronics
• Data Mining