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  • 10M50SAE144I7G

10M50SAE144I7G

FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144


  • Manufacturer: Intel
  • Origchip NO: 386-10M50SAE144I7G
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 880
  • Description: FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144 (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G144
Number of I/O 101
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 50000
Total RAM Bits 1677312
Number of LABs/CLBs 3125
RoHS Status RoHS Compliant
Factory Lead Time 11 Weeks

10M50SAE144I7G Overview


A 144-LQFP Exposed Pad package contains it, and it is available for download. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The device has 101 I/O ports for more coherent data transfer. There are 50000 logic elements/cells to form a fundamental building block. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order to operate it, it requires a voltage supply of 2.85V~3.465V . The MAX? 10 Series is one of the types of FPGAs that belong to this type. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. A model of this FPGA is contained in Tray for the purpose of saving space. There are a total of 144 terminations. The RAM bits that are offered by this fpga chips are 1677312. 3125 LABs and CLBs are built into this FPGA.

10M50SAE144I7G Features


101 I/Os
Up to 1677312 RAM bits

10M50SAE144I7G Applications


There are a lot of Intel 10M50SAE144I7G FPGAs applications.

  • Solar Energy
  • Automotive driver's assistance
  • Consumer Electronics
  • Cryptography
  • Wireless Communications
  • Digital signal processing
  • ADAS
  • Industrial IoT
  • Enterprise networking
  • Space Applications