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1106396-28

SOCKET ADAPTER DIP TO 28DIP 0.6


  • Manufacturer: Aries Electronics
  • Origchip NO: 90-1106396-28
  • Package: -
  • Datasheet: PDF
  • Stock: 733
  • Description: SOCKET ADAPTER DIP TO 28DIP 0.6 (Kg)

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IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Contact Material - Post Brass
Packaging Bulk
Published 2006
Series Correct-A-Chip® 1106396
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Positions 28
Number of Rows 2
Additional Feature SOCKET ADAPTER
Contact Finish - Mating Gold
Current Rating (Amps) 3A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 28
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Contact Style RND PIN-SKT
Row Spacing 7.62 mm
Device Socket Type IC SOCKET
Termination Post Length 0.130 3.30mm
Pitch - Post 0.100 2.54mm
Convert From (Adapter End) DIP, 0.3 (7.62mm) Row Spacing
Convert To (Adapter End) DIP, 0.6 (15.24mm) Row Spacing
Height 2.29mm
Length 35.6mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 5 Weeks
Contact Material Copper
Contact Plating Gold, Tin
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Mating Beryllium Copper
See Relate Datesheet