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  • 1SX250LH2F55E2LG

1SX250LH2F55E2LG

0°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX250LH2F55E2LG
  • Package: 2912-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 708
  • Description: 0°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O(Kg)

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Details

Tags

Parameters
Package / Case 2912-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 1160
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s) is built into this SoC.Assigned with the package 2912-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Stratix? 10 SX is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines FPGA - 2500K Logic Elements.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of 1160 I/Os in total.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LH2F55E2LG System On Chip (SoC) applications.

  • Networked Media Encode/Decode
  • Temperature
  • Robotics
  • Fitness
  • Special Issue Information
  • Efficient hardware for inference of neural networks
  • Medical Pressure
  • Embedded systems
  • Functional safety for critical applications in the automotive
  • Microcontroller based SoC ( RISC-V, ARM)