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  • 1SX250LH3F55E2LG

1SX250LH3F55E2LG

0°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX250LH3F55E2LG
  • Package: 2912-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 667
  • Description: 0°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O(Kg)

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Details

Tags

Parameters
Package / Case 2912-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 1160
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s) is built into this SoC.This system on a chip is packaged as 2912-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Stratix? 10 SX series.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines FPGA - 2500K Logic Elements and that is something to note.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 1160 I/Os.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LH3F55E2LG System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • Medical Pressure
  • Samsung galaxy gear
  • System-on-chip (SoC)
  • POS Terminals
  • Special Issue Editors
  • Temperature
  • Vending machines
  • Communication network-on-Chip (cNoC)
  • ARM support modules