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  • 1SX250LN3F43I2VG

1SX250LN3F43I2VG

-40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX250LN3F43I2VG
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 928
  • Description: -40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 688
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight? is used to build this SoC.It has been assigned a package 1760-BBGA, FCBGA by its manufacturer for this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the Stratix? 10 SX series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 2500K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.688 I/Os are included in this SoC part.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

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