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1SX250LU3F50I2LG

-40°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX250LU3F50I2LG
  • Package: 2397-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 945
  • Description: -40°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O(Kg)

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Details

Tags

Parameters
Package / Case 2397-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 704
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor.The manufacturer assigns this system on a chip with a 2397-BBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series Stratix? 10 SX.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 2500K Logic Elements is important.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 704 I/Os.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LU3F50I2LG System On Chip (SoC) applications.

  • Central alarm system
  • Industrial robot
  • Functional safety for critical applications in the aerospace
  • String inverter
  • Fitness
  • CNC control
  • Digital Signal Processing
  • Cyberphysical system-on-chip
  • DC-input BLDC motor drive
  • RISC-V