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  • 1SX280LH3F55I2VG

1SX280LH3F55I2VG

-40°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX280LH3F55I2VG
  • Package: 2912-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 878
  • Description: -40°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O(Kg)

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Details

Tags

Parameters
Package / Case 2912-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 1160
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2800K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, this SoC has been developed.This system on a chip is packaged as 2912-BBGA, FCBGA by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Stratix? 10 SX series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 2800K Logic Elements.It comes in a state-of-the-art Tray package.This SoC part contains a total of 1160 I/Os in total.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX280LH3F55I2VG System On Chip (SoC) applications.

  • Automotive gateway
  • Communication interfaces ( I2C, SPI )
  • AC drive control module
  • Industrial sectors
  • Embedded systems
  • Apple smart watch
  • System-on-chip (SoC)
  • Test and Measurement
  • Vending machines
  • Central inverter