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3-1761465-4

3-1761465-4 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from TE Connectivity AMP Connectors stock available at Utmel


  • Manufacturer: TE Connectivity AMP Connectors
  • Origchip NO: 792-3-1761465-4
  • Package: -
  • Datasheet: PDF
  • Stock: 128
  • Description: 3-1761465-4 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from TE Connectivity AMP Connectors stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 9 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Contact Material Copper Alloy
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole, Right Angle
Number of Pins 164
Housing Material Thermoplastic
Weight 21.302g
Material - Insulation Thermoplastic
PCB Mounting Orientation Right Angle
Operating Temperature -40°C~85°C
Packaging Tray
Published 2008
Feature Board Guide
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 164
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Color Black
Number of Rows 2
Gender Female
Pitch 0.039 1.00mm
Orientation Right Angle
Current Rating 1.1A
Contact Finish Gold
Number of Contacts 164
Housing Color Black
Lead Length 3.0988mm
Operating Supply Voltage 50V
Card Type PCI Express™
Read Out Dual
Termination Post Length 3.1mm
Height 9.4mm
Length 89.0016mm
Width 19.6mm
Contact Finish Thickness 15.0μin 0.38μm
Plating Thickness 381 nm
Card Thickness 0.062 1.57mm
PCB Thickness 1.5748mm
RoHS Status RoHS Compliant
Lead Free Lead Free

3-1761465-4 Overview


As per Tray's specifications, the material was packaged.We recommend mounting type Through Hole, Right Angle.This device is equipped with Board Guide features.This allows stable operation up to 85°C°C.It needs a minimum working temperature of -40°C degrees Celsius.Make sure you have 164 pins.

3-1761465-4 Features



3-1761465-4 Applications


There are a lot of TE Connectivity AMP Connectors 3-1761465-4 Edgeboard Connectors applications.

  • Battery Operated Systems
  • In-building wireless telephony
  • Micro and pico cell systems, software radios
  • Audio/Video devices
  • Scientific instruments.
  • Handheld Terminal Interface
  • Wireless and wired broadband communications
  • Digital signal processing
  • Multiplexed Data Acquisition Systems
  • Scientific instruments