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3413.0220.26

Fuse Chip Fast Acting 2.5A 32V SMD Solder Pad 1206 Glass Blister T/R


  • Manufacturer: Schurter Inc.
  • Origchip NO: 685-3413.0220.26
  • Package: 1206 (3216 Metric)
  • Datasheet: PDF
  • Stock: 512
  • Description: Fuse Chip Fast Acting 2.5A 32V SMD Solder Pad 1206 Glass Blister T/R(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 18 Weeks
Contact Plating Gold
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric)
Terminal Shape WRAPAROUND
Number of Pins 2
Housing Material Glass
Weight 99.988768mg
Operating Temperature -55°C~90°C
Packaging Tape & Reel (TR)
Series USI 1206
Size / Dimension 0.126Lx0.063W x 0.024 H 3.20mmx1.60mmx0.60mm
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Vendor Undefined
ECCN Code EAR99
Resistance 25.3mOhm
HTS Code 8536.10.00.40
Voltage - Rated DC 63V
Packing Method BLISTER TAPE AND REEL
Depth 1.6mm
Current Rating 2.5A
Reference Standard CCC; CSA; CUL; IEC; UL; VDE
Voltage - Rated AC 32V
Approval Agency cURus, VDE
Max Voltage Rating (AC) 32V
Max Voltage Rating (DC) 63V
Response Time Fast Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 63A
Melting I2t 0.94
DC Cold Resistance 0.0253Ohm
Circuit Protection Type ELECTRIC FUSE
Blow Characteristic VERY FAST
Pre-arcing Time-Min 1ms
Height 609.6μm
Radiation Hardening No
RoHS Status ROHS3 Compliant
See Relate Datesheet