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3413.0331.11

Fuse Chip Slow Blow Acting 20A 32V SMD Solder Pad 1206 Epoxy Glass Blister T/R


  • Manufacturer: Schurter Inc.
  • Origchip NO: 685-3413.0331.11
  • Package: 1206 (3216 Metric)
  • Datasheet: -
  • Stock: 712
  • Description: Fuse Chip Slow Blow Acting 20A 32V SMD Solder Pad 1206 Epoxy Glass Blister T/R(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric)
Terminal Shape WRAPAROUND
Housing Material Glass
Operating Temperature -55°C~90°C
Packaging Strip
Series UST 1206
Size / Dimension 0.126Lx0.063W x 0.024 H 3.20mmx1.60mmx0.60mm
Part Status Active
Moisture Sensitivity Level (MSL) Vendor Undefined
ECCN Code EAR99
Resistance 1.8mOhm
HTS Code 8536.10.00.40
Voltage - Rated DC 63V
Packing Method BLISTER TAPE
Depth 1.6mm
Current Rating 20A
Reference Standard CSA; UL
Voltage - Rated AC 32V
Approval Agency cURus
Body Length or Diameter 3.2mm
Physical Dimension 3.2mm x 1.6mm x 0.6mm
Response Time Slow Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 100A
Melting I2t 110
DC Cold Resistance 0.0027Ohm
Circuit Protection Type ELECTRIC FUSE
Joule Integral-Nom 110 J
Pre-arcing Time-Min 10ms
Body Height 0.6mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet