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3413.0331.24

Fuse Chip Slow Blow Acting 20A 32V SMD Solder Pad 1206 Epoxy Glass Blister T/R


  • Manufacturer: Schurter Inc.
  • Origchip NO: 685-3413.0331.24
  • Package: 1206 (3216 Metric)
  • Datasheet: PDF
  • Stock: 318
  • Description: Fuse Chip Slow Blow Acting 20A 32V SMD Solder Pad 1206 Epoxy Glass Blister T/R(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Contact Plating Gold
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric)
Terminal Shape WRAPAROUND
Housing Material Glass
Weight 10.007382mg
Operating Temperature -55°C~90°C
Packaging Tape & Reel (TR)
Series UST 1206
Size / Dimension 0.126Lx0.063W x 0.024 H 3.20mmx1.60mmx0.60mm
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Vendor Undefined
ECCN Code EAR99
Resistance 1.8mOhm
HTS Code 8536.10.00.40
Voltage - Rated DC 63V
Packing Method BLISTER TAPE AND REEL
Depth 1.6mm
Current Rating 20A
Reference Standard CSA; UL
Voltage - Rated AC 32V
Approval Agency cURus
Body Length or Diameter 3.2mm
Physical Dimension 3.2mm x 1.6mm x 0.6mm
Response Time Slow Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 100A
Melting I2t 110
DC Cold Resistance 0.0018Ohm
Circuit Protection Type ELECTRIC FUSE
Joule Integral-Nom 110 J
Pre-arcing Time-Min 10ms
Height 600μm
RoHS Status ROHS3 Compliant
See Relate Datesheet