All Products

557MI-01LF

557MI-01LF datasheet pdf and Clock/Timing - Application Specific product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-557MI-01LF
  • Package: SOIC N
  • Datasheet: PDF
  • Stock: 942
  • Description: 557MI-01LF datasheet pdf and Clock/Timing - Application Specific product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case SOIC N
Number of Pins 8
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 8
ECCN Code EAR99
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
Number of Outputs 1
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Operating Supply Current 55mA
Nominal Supply Current 55mA
Frequency (Max) 100MHz
Input Clock
Primary Clock/Crystal Frequency-Nom 25MHz
PLL Yes
Max Duty Cycle 55 %
Length 4.9mm
Width 3.9mm
Thickness 1.5mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

557MI-01LF Overview


There is a SOIC N-serial number on the packaging of this product that identifies it as being packaged in a case. In it, there are 8 terminations. There is 3.3V voltage provided by the part. Run 260 using the peak reflow temperature of this part. In a normaloperation, there is 100MHz maximum frequency. 2004 parts of this part have been published. Clock program is recommended that Clock program be mounted wClock programh Surface Mount. A device with 8 pins is designed. There are 8 pins on it. Temperatures below -40°C are not permitted for this device. Temperatures below 85°C are recommended for operation. Keeping the supply voltage at 3.3V is recommended. There is a possibility that the device will be able to maintain 1 outputs. This part is employed under 3.465V in terms of the supply voltage. For the device to maintain a supply voltage above 3.135V. A 55mA supply current is typically required for this DAC.

557MI-01LF Features


Peak Reflow Temperature (Cel): 260
with 8 Pins
operate supply voltage at the range of 3.3V

557MI-01LF Applications


There are a lot of Integrated Device Technology (IDT) 557MI-01LF application specific timer?applications.

  • Laser range finder
  • eCPRI RRH (Remote Radio Head)
  • DU (Distribution Unit)
  • DSLAM
  • PCI Express 2.0/3.0
  • Industrial, Embedded Computing
  • Audio/video
  • Wireless Infrastructure
  • Industrial, Embedded Computing
  • Telecom line cards