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  • 5AGXFB1H4F35I3G

5AGXFB1H4F35I3G

FPGAs Arria V GX Series 1152-BBGA, FCBGA Exposed Pad


  • Manufacturer: Intel
  • Origchip NO: 386-5AGXFB1H4F35I3G
  • Package: 1152-BBGA, FCBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 571
  • Description: FPGAs Arria V GX Series 1152-BBGA, FCBGA Exposed Pad (Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package 1152-FBGA (35x35)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria V GX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.12V~1.18V
Number of I/O 544
Number of Logic Elements/Cells 300000
Total RAM Bits 17358848
Number of LABs/CLBs 14151
RoHS Status RoHS Compliant

5AGXFB1H4F35I3G Overview


A 1152-BBGA, FCBGA Exposed Pad package contains it, and it is available for download. 544 I/Os are available for transferring data more efficiently. There are 300000 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 1.12V~1.18V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Arria V GX series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 17358848 bfpga electronics s of RAM. Fpga electronics contains 14151 LABs/CLBs in an array. Device package 1152-FBGA (35x35) is provided by its supplier.

5AGXFB1H4F35I3G Features


544 I/Os
Up to 17358848 RAM bits

5AGXFB1H4F35I3G Applications


There are a lot of Intel 5AGXFB1H4F35I3G FPGAs applications.

  • High Performance Computing
  • Solar Energy
  • ADAS
  • Filtering and communication encoding
  • Random logic
  • Integrating multiple SPLDs
  • Wireless Communications
  • Telecommunication
  • ASIC prototyping
  • Data center search engines