5AGXFB3H4F35I3N

5AGXFB3H4F35I3N Overview

There are two packages that contain fpga chips: 1152-BBGA, FCBGA Exposed Pad package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 544 I/O ports for more coherent data transfer. A fundamental building block contains 362000 logic elements or cells. Supply voltage is 1.15V volts. This FPGA module can be attached to the development board with a Surface Mount. A supply voltage of 1.12V~1.18V is needed in order for fpga chips to operate. An FPGA belonging to the Arria V GX series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device is equipped with 19822592 RAM bits in terms of its RAM si19822592e. In order to find related parts, you can use its base part number 5AGXFB3. A total of 17110 LABs/CLBs are included in this FPGA. Typically, fpga semiconductor uses a crystal oscillating at 670MHz .

5AGXFB3H4F35I3N Features

544 I/Os
Up to 19822592 RAM bits

5AGXFB3H4F35I3N Applications

There are a lot of Intel 5AGXFB3H4F35I3N FPGAs applications.

• Telecommunication
• Industrial IoT
• Automotive Applications
• Video & Image Processing
• Data Mining
• Software-defined radio
• Filtering and communication encoding
• Automotive driver's assistance
• Data center hardware accelerators
• Development Boards and Shields for Microcontrollers