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5CSXFC6D6F31C8NES

0°C~85°C TJ 5CSXFC6 System On ChipCyclone? V SX Series MCU - 181, FPGA - 288 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-5CSXFC6D6F31C8NES
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: 329
  • Description: 0°C~85°C TJ 5CSXFC6 System On ChipCyclone? V SX Series MCU - 181, FPGA - 288 I/O(Kg)

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Details

Tags

Parameters
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® V SX
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number 5CSXFC6
Number of I/O MCU - 181, FPGA - 288
Speed 600MHz
RAM Size 64KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 110K Logic Elements

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Manufacturer assigns package 896-BGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the Cyclone? V SX series of system on a chips.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.This SoC security combines FPGA - 110K Logic Elements and that is something to note.It comes in a state-of-the-art Tray package.This SoC part contains a total of MCU - 181, FPGA - 288 I/Os in total.Searching 5CSXFC6 will yield system on chips with similar specs and purposes.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


64KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


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