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628-65AB

HEATSINK CPU 43MM SQ BLK H=.65"


  • Manufacturer: Wakefield-Vette
  • Origchip NO: 869-628-65AB
  • Package: BGA
  • Datasheet: -
  • Stock: 503
  • Description: HEATSINK CPU 43MM SQ BLK H=.65" (Kg)

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Purchase

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Means of Payment

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RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mount Adhesive
Package / Case BGA
Material Aluminum
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Packaging Bulk
Published 2001
Series 628
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Attachment Method Thermal Tape, Adhesive (Not Included)
Height Off Base (Height of Fin) 0.650 16.51mm
Thermal Resistance @ Forced Air Flow 2.00°C/W @ 400 LFM
Natural Thermal Resistance 2 °C/W
Profile PIN FIN ARRAY
Power Dissipation @ Temperature Rise 3.0W @ 20°C
Fin Orientation OMNIDIRECT
Height 16.5mm
Length 1.750 44.45mm
Width 1.700 43.18mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet