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  • 67SLG040035030PI00

67SLG040035030PI00

67SLG040035030PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-67SLG040035030PI00
  • Package: -
  • Datasheet: PDF
  • Stock: 219
  • Description: 67SLG040035030PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Published 2015
Series SMD Grounding Metallized
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.138 3.50mm
Length 0.118 3.00mm
Width 0.157 4.00mm
Thickness 3.5052mm
RoHS Status RoHS Compliant

67SLG040035030PI00 Overview


The Contact RFI contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI can work at -40°C~70°C.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.

67SLG040035030PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series

67SLG040035030PI00 Applications


There are a lot of Laird Technologies EMI 67SLG040035030PI00 RFI and EMI Contacts applications.

  • Thermostats
  • Secure Payment
  • Fitness
  • Home and Security
  • Smart Meters
  • Industrial Logger
  • LoT applications
  • Low Noise Amplifier
  • LED Lighting