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  • 67SLG100150100PI00

67SLG100150100PI00

67SLG100150100PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-67SLG100150100PI00
  • Package: -
  • Datasheet: PDF
  • Stock: 731
  • Description: 67SLG100150100PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Published 2015
Series SMD Grounding Metallized
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.591 15.00mm
Length 0.394 10.00mm
Width 0.394 10.00mm
Thickness 15.0114mm
RoHS Status RoHS Compliant

67SLG100150100PI00 Overview


Materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU) are included in the Contact RFI.The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured.At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam Type from the contacter RFI.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.

67SLG100150100PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series

67SLG100150100PI00 Applications


There are a lot of Laird Technologies EMI 67SLG100150100PI00 RFI and EMI Contacts applications.

  • Fitness
  • Smart Meters
  • Health and Fitness
  • Receive
  • Internet of Things
  • Switch
  • Smart Energy
  • Industrial Logger
  • Transmit
  • Health care