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  • 67SLH050050025PI00

67SLH050050025PI00

67SLH050050025PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-67SLH050050025PI00
  • Package: -
  • Datasheet: PDF
  • Stock: 463
  • Description: 67SLH050050025PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Hourglass
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Published 2015
Series SMD Grounding Metallized
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.197 5.00mm
Length 0.098 2.50mm
Width 0.197 5.00mm
Thickness 5.0038mm
RoHS Status RoHS Compliant

67SLH050050025PI00 Overview


There are materials in the Contact RFI package from Polyurethane Foam, Tin-Copper Polyester (SN/CU).EMI/RFIs capable of operating at -40°C~70°C can be used.High reliability is provided by the advanced RFI and EMI contact' packaging Tape & Reel (TR).At158°C, contacter RFI should run.Film Over Foam Type from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.

67SLH050050025PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series

67SLH050050025PI00 Applications


There are a lot of Laird Technologies EMI 67SLH050050025PI00 RFI and EMI Contacts applications.

  • Medical
  • LED Lighting
  • Low Noise Amplifier
  • Internet of Things
  • Fitness
  • Health care
  • Digital Remote
  • Health and Fitness
  • Power management
  • Home and Security