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  • 67SLH050050050PI00

67SLH050050050PI00

67SLH050050050PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-67SLH050050050PI00
  • Package: -
  • Datasheet: PDF
  • Stock: 587
  • Description: 67SLH050050050PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Hourglass
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Published 2015
Series SMD Grounding Metallized
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.197 5.00mm
Length 0.197 5.00mm
Width 0.197 5.00mm
Thickness 5.0038mm
RoHS Status RoHS Compliant

67SLH050050050PI00 Overview


Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.High reliability is achieved with advanced RFI and EMI contact' packaging Tape & Reel (TR).There should be 158°C temperature above 158°C degrees Celsius when contacter RFI runs.A type of Film Over Foam is provided by the contacter RFI.The RFI EMI comes from the well-known SMD Grounding Metallized series.

67SLH050050050PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series

67SLH050050050PI00 Applications


There are a lot of Laird Technologies EMI 67SLH050050050PI00 RFI and EMI Contacts applications.

  • Home and Security
  • Receive
  • Switch
  • Power management
  • Smart Energy
  • Internet of Things
  • Transmit
  • Industrial Logger
  • Power Amplifier