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  • 67SLH060080080PI00

67SLH060080080PI00

67SLH060080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-67SLH060080080PI00
  • Package: -
  • Datasheet: PDF
  • Stock: 518
  • Description: 67SLH060080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Hourglass
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Published 2015
Series SMD Grounding Metallized
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.315 8.00mm
Length 0.315 8.00mm
Width 0.236 6.00mm
Thickness 8.001mm
RoHS Status RoHS Compliant

67SLH060080080PI00 Overview


Contact RFI consists of materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).If the EMI/RFI is set to -40°C~70°C, it will work normally.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.Running the contacter RFI at 158°C is ideal.The contacter RFI type is Film Over Foam.As you can see, this RFI EMI comes from the well-known SMD Grounding Metallized series of products.

67SLH060080080PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series

67SLH060080080PI00 Applications


There are a lot of Laird Technologies EMI 67SLH060080080PI00 RFI and EMI Contacts applications.

  • Health care
  • LoT applications
  • Industrial Logger
  • Internet of Things
  • Digital Remote
  • Receive
  • Low Noise Amplifier
  • Power Amplifier
  • Utility Energy