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  • 67SLH080080080PI00

67SLH080080080PI00

67SLH080080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-67SLH080080080PI00
  • Package: -
  • Datasheet: PDF
  • Stock: 598
  • Description: 67SLH080080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Hourglass
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Published 2015
Series SMD Grounding Metallized
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.315 8.00mm
Length 0.315 8.00mm
Width 0.315 8.00mm
Thickness 8.001mm
RoHS Status RoHS Compliant

67SLH080080080PI00 Overview


Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).-40°C~70°C is a valid operating temperature for the EMI/RFI.In order to provide high reliability, advanced RFI and EMI contact' packaging Tape & Reel (TR) is used.At158°C, contacter RFI should run.Film Over Foam Type from the contacter RFI.As the name implies, this RFI EMI is a kind of the famous SMD Grounding Metallized series product line.

67SLH080080080PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series

67SLH080080080PI00 Applications


There are a lot of Laird Technologies EMI 67SLH080080080PI00 RFI and EMI Contacts applications.

  • LoT applications
  • Digital Remote
  • Transmit
  • Smart Energy
  • Health and Fitness
  • Secure Payment
  • Health care
  • Power Amplifier
  • Home and Security
  • Internet of Things