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7-530671-6

7-530671-6 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from TE Connectivity AMP Connectors stock available at Utmel


  • Manufacturer: TE Connectivity AMP Connectors
  • Origchip NO: 792-7-530671-6
  • Package: -
  • Datasheet: PDF
  • Stock: 293
  • Description: 7-530671-6 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from TE Connectivity AMP Connectors stock available at Utmel(Kg)

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Details

Tags

Parameters
Lead Length 3.81mm
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 28
Row Spacing 5.08 mm
ELV Compliant
Contact Current Rating 5A
Height 11.68mm
Contact Finish Thickness 50.0μin 1.27μm
Plating Thickness 760 nm
Card Thickness 0.055 ~ 0.070 1.40mm ~ 1.78mm
RoHS Status RoHS Compliant
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact Material Phosphor Bronze
Contact Plating Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Glass
Material - Insulation Polyester, Glass Filled
Underplate Material Nickel
Operating Temperature -55°C~105°C
Packaging Bulk
Published 2009
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, Receptacle, Socket
Number of Positions 56
Color Green
Number of Rows 2
Gender Female
Additional Feature LOW PROFILE
HTS Code 8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.125 3.18mm
Total Number of Contacts 28
Orientation Vertical
Current Rating 5A
Contact Finish Gold

7-530671-6 Overview


Packing was done according to Bulk's specs.It's best to mount type Through Hole.This device is connected through the connector socket Connector, Receptacle, Socket.There are the following additional features of this chip: LOW PROFILE

7-530671-6 Features



7-530671-6 Applications


There are a lot of TE Connectivity AMP Connectors 7-530671-6 Edgeboard Connectors applications.

  • In-building wireless telephony
  • Battery Operated Systems
  • Data Acquisition Systems
  • Scientific instruments.
  • CMOS Image sensors for mobile applications
  • Uninterrupted Power Supplies
  • Wireless local loop
  • Displaying
  • Broadband data applications
  • Microcontrollers.