All Products

7201LA25TP

28 Terminations5V 28 Pin FIFO memory IC25 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-7201LA25TP
  • Package: PDIP
  • Datasheet: PDF
  • Stock: 995
  • Description: 28 Terminations5V 28 Pin FIFO memory IC25 ns Min 4.5V VMax 5.5V V(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Contact Plating Lead, Tin
Mount Through Hole
Package / Case PDIP
Number of Pins 28
Weight 4.190003g
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1
Number of Terminations 28
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 2.54mm
Pin Count 28
Operating Supply Voltage 5V
Power Supplies 5V
Temperature Grade COMMERCIAL
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 80mA
Max Supply Current 80mA
Access Time 25 ns
Data Bus Width 9b
Direction Bidirectional
Organization 512X9
Density 4.5 kb
Standby Current-Max 0.0005A
Parallel/Serial PARALLEL
Sync/Async Asynchronous
Word Size 9b
Memory IC Type OTHER FIFO
Bus Directional Unidirectional
Retransmit Capability Yes
Programmable Flags Support No
Output Enable NO
Cycle Time 35 ns
Height Seated (Max) 4.572mm
Length 34.3mm
Width 7.62mm
Thickness 3.3mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

7201LA25TP Overview


You will find FIFO memory chip in the PDIP package.Memory IC's recommended mounted way is Through Hole .If the supply voltage is set to 5V , high efficiency can be achieved.A total of 28 terminations are contained within FIFO means.These are the 28 pins for operation.In order for FIFO design to operate, a maximum current of 80mA is required.FIFO is recommended that the supply voltage be set to 5V for maximum efficiency.Keeping the temperature at 0°C degrees Celsius ensures its reliability.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.A self-contained gadget is contained within FIFOs .There is a memory type OTHER FIFO in the IC of this part.The FIFO memory chip may be operated at very low supply voltages, such as4.5V volts.The memory logic's maximum supply voltage is 5.5V volts.This FIFO memory IC is equipped with 28 pins in total.Components normally possess 5V power supplies.With the help of this FIFO memory, RETRANSMIT can also be generated.

7201LA25TP Features


FIFOs category

7201LA25TP Applications


There are a lot of Integrated Device Technology (IDT) 7201LA25TP FIFOs Memory applications.

  • Data-acquisition systems
  • Computer Systems
  • Routers
  • A/D output buffers
  • Down-Hole Energy Drilling
  • One assembly
  • Queues for communication systems
  • Switches
  • Cameras
  • Consumer Systems