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  • 7206L25JI

7206L25JI

5V 32 Pin FIFO memory IC25 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-7206L25JI
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 958
  • Description: 5V 32 Pin FIFO memory IC25 ns Min 4.5V VMax 5.5V V(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2005
Part Status Active
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 120mA
Max Supply Current 120mA
Access Time 25 ns
Direction Unidirectional
Density 144 kb
Sync/Async Asynchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Programmable Flags Support No
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

7206L25JI Overview


The PLCC package contains FIFO memory chip.It is pointing in the direction of Surface Mount .Operation pins are 32 .There is a maximum current requirement of 120mA for its operation.In order to maximize efficiency, the supply voltage should be set to 5V .In order to ensure reliability, FIFO is maintained at -40°C degrees Celsius at all times.By operating at 85°C degrees Celsius, this FIFO products is able to maintain a stable operation.If the supply voltage is very low, such as 4.5V V, FIFO may be able to operate.A maximum voltage of 5.5V volts can be applied to FIFO memory.

7206L25JI Features



7206L25JI Applications


There are a lot of Integrated Device Technology (IDT) 7206L25JI FIFOs Memory applications.

  • Video Processing
  • MP3 Interface for Automobile
  • GPS Offender Tracking
  • Tape controllers
  • Network switching/routing
  • Seismic Data Collection at Extreme Temperatures
  • Game Consoles
  • Industrial Systems
  • Optical memories
  • Thermal Management for DDR3 Memory Modules