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7206L35P
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 28-DIP (0.600, 15.24mm) |
| Supplier Device Package | 28-PDIP |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Series | 7200 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 4.5V~5.5V |
| Base Part Number | 7206 |
| Function | Asynchronous |
| Current - Supply (Max) | 120mA |
| Memory Size | 144K 16K x 9 |
| Access Time | 35ns |
| Data Rate | 22.22MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| FWFT Support | No |
| Programmable Flags Support | No |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
7206L35P Overview
28-DIP (0.600, 15.24mm) is the package in which FIFO memory chip is contained.In the shape of a Tube , it's packaged.The FIFO chips have a memory of 144K 16K x 9 that can be used to store applications and data.Reliable operation requires a temperature of 0°C~70°C .There is a mounting type of Through Hole on the FIFO memory.A voltage supply of 4.5V~5.5V is needed to operate it.It belongs to the 7200 series of memory logics.As far as operating current is concerned, it has a maximum of 120mA .Memory IC is a member of the 7206 family.
7206L35P Features
144K 16K x 9 memory size
7200 series
Best part number of 7206
7206L35P Applications
There are a lot of Renesas Electronics America Inc. 7206L35P FIFOs Memory applications.
- Analog-to-digital converters
- Magnetic memories
- Thermal Management for DDR3 Memory Modules
- Communications
- Digital buffering
- Networking
- Temporary storage elements
- Data
- Portable Information Devices
- Down-Hole Energy Drilling