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72235LB15TFGI8

72235 FIFO memory IC7200 Series 36K 2K x 1810ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-72235LB15TFGI8
  • Package: 64-LQFP
  • Datasheet: PDF
  • Stock: 600
  • Description: 72235 FIFO memory IC7200 Series 36K 2K x 1810ns (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package 64-TQFP (10x10)
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Series 7200
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.5V~5.5V
Base Part Number 72235
Function Synchronous
Current - Supply (Max) 60mA
Memory Size 36K 2K x 18
Access Time 10ns
Data Rate 66.7MHz
Bus Directional Uni-Directional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Expansion Type Depth, Width
RoHS Status ROHS3 Compliant

72235LB15TFGI8 Overview


This package is included in 64-LQFP .In the shape of a Tape & Reel (TR) , it's packaged.It is possible to store data and applications on the FIFO chips as they have 36K 2K x 18 in their memory.To ensure reliable operation, the temperature should be regulated to -40°C~85°C .Mounting type Surface Mount indicates that the FIFO memory is mounted.Operating voltage is 4.5V~5.5V .It is part of the 7200 series of memory logics.60mA is memory IC's maximum operating supply current.The 72235 family contains this item.

72235LB15TFGI8 Features


36K 2K x 18 memory size
7200 series
Best part number of 72235

72235LB15TFGI8 Applications


There are a lot of Renesas Electronics America Inc. 72235LB15TFGI8 FIFOs Memory applications.

  • Emulators
  • Routers
  • Consumer
  • Event Recorder
  • Communications
  • Buses
  • Network bridges
  • Fabrication Site
  • TVs
  • General Data Collection Applications at Low-Temperatures