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  • 72271LA10TF8

72271LA10TF8

5V 64 Pin FIFO memory IC8 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72271LA10TF8
  • Package: LQFP
  • Datasheet: PDF
  • Stock: 286
  • Description: 5V 64 Pin FIFO memory IC8 ns Min 4.5V VMax 5.5V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case LQFP
Number of Pins 64
Packaging Tape & Reel
Published 2009
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 100MHz
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 75mA
Max Supply Current 75mA
Frequency (Max) 100MHz
Access Time 8 ns
Direction Unidirectional
Density 288 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 10mm
Width 10mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72271LA10TF8 Overview


You will find FIFO memory chip in the LQFP package.You'll find it packaged in the shape of a Tape & Reel .Mounting it in the Surface Mount way is recommended.There are 64 pins on the operation pins.FIFO requires a minimum of 75mA current to operate.A supply voltage of 5V is recommended for FIFO's maximum efficiency.At a minimum working temperature of 0°C degrees Celsius, FIFO is guaranteed to operate reliably.As a result of having a maximum operating temperature of 70°C degrees Celsius, the unit is capable of exhibiting stable operation.FIFO memory chips may be operated at very low supply voltages, such as 4.5V volts.FIFO memory is capable of handling a maximum supply voltage of 5.5V volts.When the frequency is set to 100MHz it can maintain good accuracy.There is 100MHz FIFO memory IC's maximum value for regular operation.

72271LA10TF8 Features


Frequency at most

72271LA10TF8 Applications


There are a lot of Integrated Device Technology (IDT) 72271LA10TF8 FIFOs Memory applications.

  • Character generators
  • Data-acquisition systems
  • General Data Collection Applications at Extreme High-Temperatures
  • Network switching/routing
  • Extended product life cycle
  • IP Radio
  • Buses
  • Seismic Data Collection at Extreme Temperatures
  • One assembly
  • High-speed disk