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  • 723641L15PFG8

723641L15PFG8

5V 120 Pin FIFO memory IC11 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-723641L15PFG8
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 704
  • Description: 5V 120 Pin FIFO memory IC11 ns Min 4.5V VMax 5.5V V(Kg)

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Details

Tags

Parameters
Word Size 36b
Bus Directional Bidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 14mm
Width 14mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 120
Packaging Tape & Reel
Published 2009
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 66.7MHz
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 400μA
Max Supply Current 400μA
Frequency (Max) 66.7MHz
Access Time 11 ns
Direction Bidirectional
Density 36 kb
Sync/Async Synchronous

723641L15PFG8 Overview


TQFP is a package that contains FIFO memory chip.In the shape of a Tape & Reel , it's packaged.Surface Mount is memory IC's recommended mounting method.FIFO design has 120 operation pins.There is a maximum current requirement of 400μA for its operation.A supply voltage of 5V is recommended for FIFO's maximum efficiency.At a minimum working temperature of 0°C degrees Celsius, FIFO is guaranteed to operate reliably.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.If the supply voltage is very low, such as 4.5V V, FIFO may be able to operate.FIFO memory can handle a maximum supply voltage of 5.5V V.It is capable of maintaining good accuracy with a frequency of 66.7MHz .During regular operation, the FIFO memory's maximum value is 66.7MHz .

723641L15PFG8 Features


Frequency at most

723641L15PFG8 Applications


There are a lot of Integrated Device Technology (IDT) 723641L15PFG8 FIFOs Memory applications.

  • Multimedia
  • General Data Collection Applications at Extreme High-Temperatures
  • Networking
  • Firmware loaders
  • Network switching/routing
  • High-speed disk
  • Tape controllers
  • General Data Collection Applications at Low-Temperatures
  • Portable Information Devices
  • Data communications