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7281L12PA
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 56-TFSOP (0.240, 6.10mm Width) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Series | 7200 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 4.5V~5.5V |
| Base Part Number | 7281 |
| Function | Asynchronous |
| Current - Supply (Max) | 125mA |
| Memory Size | 9K 512 x 9 x 2 |
| Access Time | 12ns |
| Data Rate | 50MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| Programmable Flags Support | No |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
7281L12PA Overview
The 56-TFSOP (0.240, 6.10mm Width) package contains FIFO memory chip.This FIFO memory chip is packaged as a Tube .In addition, the FIFO chip has a memory capacity of 9K 512 x 9 x 2 , which can be used to store applications and data.It is advisable to regulate the temperature to 0°C~70°C to ensure reliable operation.It is a Surface Mount mounting type FIFO memory.A voltage supply of 4.5V~5.5V is needed to operate it.It belongs to the 7200 series of memory logics.A FIFO's maximum operating supply current of 125mA is available.The 7281 family of integers consists of this type.
7281L12PA Features
9K 512 x 9 x 2 memory size
7200 series
Best part number of 7281
7281L12PA Applications
There are a lot of Renesas Electronics America Inc. 7281L12PA FIFOs Memory applications.
- Look-up Tables
- Computer Systems
- Thermal Management for DDR3 Memory Modules
- High-speed disk
- Portable Information Devices
- Emulators
- Networking
- General Data Collection Applications at Low-Temperatures
- Tape controllers
- Industrial Systems