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  • 7283L15PA

7283L15PA

5V 56 Pin FIFO memory IC15 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-7283L15PA
  • Package: TSSOP
  • Datasheet: PDF
  • Stock: 626
  • Description: 5V 56 Pin FIFO memory IC15 ns Min 4.5V VMax 5.5V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TSSOP
Number of Pins 56
Published 2005
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 150mA
Max Supply Current 150mA
Access Time 15 ns
Direction Unidirectional
Density 36 kb
Sync/Async Asynchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Programmable Flags Support No
Length 14mm
Width 6.1mm
Thickness 1mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

7283L15PA Overview


FIFO memory chip is contained in the TSSOP package.The recommended mounting method for this FIFO products is Surface Mount .There are 56 pins on the operation pins.In order to operate FIFO design, a maximum current of 150mA is required.A voltage of 5V should be used for FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.Typically, FIFO would work at 4.5V volts, but it may also work at higher voltages.A maximum voltage of 5.5V volts can be applied to FIFO memory.

7283L15PA Features



7283L15PA Applications


There are a lot of Integrated Device Technology (IDT) 7283L15PA FIFOs Memory applications.

  • Video Processing
  • GPS Offender Tracking
  • Digital buffering
  • Optical memories
  • Seismic Data Collection at Extreme Temperatures
  • High-speed graphics pixel buffer
  • Video time base correction
  • Thermal Management for DDR3 Memory Modules
  • General Data Collection Applications at Extreme High-Temperatures
  • Firmware loaders