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  • 72T1895L4-4BB

72T1895L4-4BB

2.5V 144 Pin FIFO memory IC3.4 ns Min 2.375V VMax 2.625V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72T1895L4-4BB
  • Package: BGA
  • Datasheet: PDF
  • Stock: 971
  • Description: 2.5V 144 Pin FIFO memory IC3.4 ns Min 2.375V VMax 2.625V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Packaging Bulk
Published 2009
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Operating Supply Voltage 2.5V
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Element Configuration Dual
Nominal Supply Current 60mA
Max Supply Current 60mA
Frequency (Max) 225MHz
Access Time 3.4 ns
Density 1.1 Mb
Sync/Async Asynchronous
Bus Directional Unidirectional
Retransmit Capability Yes
Length 13mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72T1895L4-4BB Overview


BGA is a package that contains FIFO memory chip.There is a case Bulk in which it is packaged.Surface Mount is memory IC's recommended mounting method.Operation pins are 144 .For its operation, 60mA is the maximum current required.FIFO is recommended that the supply voltage be set to 2.5V in order to maximize efficiency.For reliability, FIFO works at a minimum temperature of 0°C degrees Celsius.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.FIFO memory chips may be operated at very low supply voltages, such as 2.375V volts.A maximum supply voltage of 2.625V V can be handled by this FIFO memory chip.225MHz is the FIFO memory IC's maximum value for regular operation.

72T1895L4-4BB Features


Frequency at most

72T1895L4-4BB Applications


There are a lot of Integrated Device Technology (IDT) 72T1895L4-4BB FIFOs Memory applications.

  • Controlled baseline
  • Test Equipment
  • Desktop Computers
  • Data-acquisition systems
  • Communications Systems
  • Character generators
  • Digital buffering
  • General Data Collection Applications at Low-Temperatures
  • Extended product life cycle
  • Network switching/routing