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  • 72T36125L5BBI

72T36125L5BBI

72T36125 FIFO memory IC72T Series 9M 256K x 3610ns, 3.6ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-72T36125L5BBI
  • Package: 240-BGA
  • Datasheet: PDF
  • Stock: 375
  • Description: 72T36125 FIFO memory IC72T Series 9M 256K x 3610ns, 3.6ns (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 240-BGA
Operating Temperature -40°C~85°C
Packaging Tray
Series 72T
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Base Part Number 72T36125
Function Asynchronous, Synchronous
Current - Supply (Max) 90mA
Memory Size 9M 256K x 36
Access Time 10ns, 3.6ns
Data Rate 83MHz, 200MHz
Bus Directional Uni-Directional
FWFT Support Yes
Expansion Type Depth, Width
RoHS Status Non-RoHS Compliant

72T36125L5BBI Overview


You can find FIFO memory chip in the 240-BGA package.In this case, it is packaged in case number Tray .A memory of 9M 256K x 36 is available for storing applications and data on this FIFO chip.Reliable operation requires a temperature of -40°C~85°C .Mounting type Surface Mount is assigned to the FIFO memory.To operate, the FIFO products requires a voltage supply of 2.375V~2.625V .It belongs to the 72T series of memory logics.There is a maximum operating current of 90mA in memory IC's supply.This object belongs to the family 72T36125 .

72T36125L5BBI Features


9M 256K x 36 memory size
72T series
Best part number of 72T36125

72T36125L5BBI Applications


There are a lot of Renesas Electronics America Inc. 72T36125L5BBI FIFOs Memory applications.

  • Controlled baseline
  • Notebook
  • Firmware loaders
  • Medical Monitoring Device
  • Temporary storage elements
  • Disk Controllers
  • SPI Bus Flash Memory Device
  • General Data Collection Applications at Low-Temperatures
  • Test site
  • Thermal Management for DDR3 Memory Modules