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72T3665L4-4BB

72T3665 FIFO memory IC72T Series 144K 4K x 368ns, 3.4ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-72T3665L4-4BB
  • Package: 208-BGA
  • Datasheet: PDF
  • Stock: 554
  • Description: 72T3665 FIFO memory IC72T Series 144K 4K x 368ns, 3.4ns (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 208-BGA
Operating Temperature 0°C~70°C
Packaging Tray
Series 72T
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Base Part Number 72T3665
Function Asynchronous, Synchronous
Current - Supply (Max) 70mA
Memory Size 144K 4K x 36
Access Time 8ns, 3.4ns
Data Rate 100MHz, 225MHz
Bus Directional Uni-Directional
FWFT Support Yes
Expansion Type Depth, Width
RoHS Status Non-RoHS Compliant

72T3665L4-4BB Overview


FIFO memory chip is included in the 208-BGA package.Tray case is used for packaging.There is a memory of 144K 4K x 36 on the FIFO chip that can be used to store applications and data.It is recommended that the temperature of the system be regulated to 0°C~70°C for reliable operation.There is a mounting type of Surface Mount on the FIFO memory.A 2.375V~2.625V supply voltage is required to power it.It is a member of the 72T series .This FIFO products can operate at a maximum operating supply current of 70mA .In terms of its family, it is part of the 72T3665 family.

72T3665L4-4BB Features


144K 4K x 36 memory size
72T series
Best part number of 72T3665

72T3665L4-4BB Applications


There are a lot of Renesas Electronics America Inc. 72T3665L4-4BB FIFOs Memory applications.

  • SPI Bus Flash Memory Devices
  • Routers
  • Medical Monitoring Device
  • Test Equipment
  • High-speed graphics pixel buffer
  • IP Radio
  • MP3 Interface for Automobile
  • Wireless
  • Seismic Data Collection at Extreme Temperatures
  • Microprogramming