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72V223L6BC

3.3V 100 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V223L6BC
  • Package: -
  • Datasheet: PDF
  • Stock: 542
  • Description: 3.3V 100 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Number of Pins 100
Packaging Bulk
Published 2009
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 166MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Max Supply Current 35mA
Frequency (Max) 166MHz
Access Time 4 ns
Direction Unidirectional
Density 9 kb
Sync/Async Synchronous
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 11mm
Width 11mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V223L6BC Overview


In this case, it is packaged in case number Bulk .Mounting it in the Surface Mount way is recommended.There are 100 pins for operation.In order for FIFO design to operate, a maximum current of 35mA is required.The supply voltage should be set to 3.3V in order to achieve FIFO's maximum efficiency.For reliability, FIFO works at a minimum temperature of 0°C degrees Celsius.By operating at 70°C degrees Celsius, this FIFO products is able to maintain a stable operation.FIFO may operate at a very low supply voltage, such as 3.15V V.FIFO memory can handle a maximum supply voltage of 3.45V V.Despite a frequency of 166MHz , it is capable of maintaining good accuracy.There is 166MHz FIFO memory IC's maximum value for regular operation.

72V223L6BC Features


Frequency at most

72V223L6BC Applications


There are a lot of Integrated Device Technology (IDT) 72V223L6BC FIFOs Memory applications.

  • Rate buffers
  • Communications
  • Communications Systems
  • Tape controllers
  • MP3 Interface for Automobile
  • Thermal Management for DDR3 Memory Modules
  • SPI Bus Flash Memory Devices
  • One assembly
  • Extended product life cycle
  • Transistors